US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 20 for "Forming openings through carrier substrate of IC package assembly for fault identification" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,720, issued on Jan. 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Forming openings through carrier substrate of IC package assembly for fault identification" was invented by Kao-Chih Liu (Changhua County, Taiwan), Wenmin Hsu (Hsinchu, Taiwan), Hsuan Jung Chiu (Taichung, Taiwan), Yu-Ting Lin (Hsin-Chu, Taiwan) and Chia Hong Lin (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor substrate includes a plurality of transistors. A first structure is disposed over a first side of the semiconductor substrate. The first structure contains a plurality of first metallization componen...