US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 3 for "Package with improved heat dissipation efficiency and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,569, issued on Feb. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package with improved heat dissipation efficiency and method for forming the same" was invented by Hung-Yi Kuo (Taipei, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan), Kuo-Chung Yee (Taoyuan, Taiwan), Cheng-Chieh Hsieh (Tainan, Taiwan), Chung-Ju Lee (Hsinchu, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a package includes an interposer; a first integrated circuit device attached to the interposer, wherein the first integrated circuit device includes a die and a heat dissipation structure, the die h...