US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 3 for "Method of making package including stress relief structures and package" (Taiwanese Inventor)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,571, issued on Feb. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD (Hsinchu, Taiwan).

"Method of making package including stress relief structures and package" was invented by Hsien-Wei Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a substrate. The package further includes a first die on the substrate. The package further includes a second die on the substrate. The package further includes a first stress relief structure on the substrate, wherein a distance between the first stress relief structure to the first die is a first distance. The package further includes a second stress relief str...