US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 3 for "Machine learning-based transformation of low-resolution wafer inspection images to high resolution images" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,904, issued on Feb. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Machine learning-based transformation of low-resolution wafer inspection images to high resolution images" was invented by Shao-Chien Chiu (Hsinchu, Taiwan), Ting-Chun Peng (New Taipei, Taiwan), To-Yu Chen (Yunlin, Taiwan) and Mao-Chih Huang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A defect inspection method is disclosed. The method includes acquiring a plurality of first images of a first specimen in a first resolution. The method includes acquiring a plurality of second images of the first specimen in a second resolution, t...