US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 24 for "Semiconductor structure and method for manufacturing thereof" (Taiwanese, Chinese, American Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,819, issued on Feb. 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method for manufacturing thereof" was invented by Man-Ho Kwan (Kowloon, Hong Kong), Fu-Wei Yao (Hsinchu, Taiwan), Ru-Yi Su (Yunlin County, Taiwan), Chun Lin Tsai (Hsin-Chu, Taiwan) and Alexander Kalnitsky (San Francisco).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and method for manufacturing thereof are provided. The semiconductor structure includes a silicon substrate having a first surface, a III-V layer on the first surface of the silicon substrate and over a first active region, and ...