US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 24 for "Package structure and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,108, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of fabricating the same" was invented by Ming-Fa Chen (Taichung, Taiwan), Nien-Fang Wu (Chiayi, Taiwan), Sung-Feng Yeh (Taipei, Taiwan), Tzuan-Horng Liu (Taoyuan, Taiwan) and Chao-Wen Shih (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A structure including stacked substrates, a first semiconductor die, a second semiconductor die, and an insulating encapsulation is provided. The first semiconductor die is disposed over the stacked substrates. The second semiconductor die is stacked over the firs...