ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,054, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structure" was invented by Hao-Jan Pei (Hsinchu, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Hsiu-Jen Lin (Hsinchu County, Taiwan), Wei-Yu Chen (Taipei, Taiwan), Chia-Shen Cheng (Hsinchu County, Taiwan), Chih-Chiang Tsao (Taoyuan, Taiwan), Jen-Jui Yu (Taipei, Taiwan) and Cheng-Shiuan Wong (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant a...