ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,089, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structure" was invented by Chung-Ming Weng (Taichung, Taiwan), Tzu-Sung Huang (Tainan, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Ming-Hung Tseng (Miaoli County, Taiwan), Tsung-Hsien Chiang (Hsinchu, Taiwan) and Yen-Liang Lin (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure including a semiconductor die, a redistribution layer structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution layer structure is disposed on the s...