US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 24 for "Package component, electronic device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,109, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package component, electronic device and manufacturing method thereof" was invented by Chih-Wei Wu (Yilan County, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan) and Ying-Ching Shih (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a first dielectric layer disposed on a first patterned circuit layer, a first conductive via in the first dielectric layer and electrically connected to the first patterned circuit layer, a circuit layer on the first dielectric layer, a second dielectric layer on the first dielectric lay...