US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 24 for "Method and treatment system for uniform processing of semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,008, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method and treatment system for uniform processing of semiconductor devices" was invented by Cheng-Shiuan Wong (Hsinchu, Taiwan), Chao-Wei Chiu (Hsinchu, Taiwan), Wei-Yu Chen (Taipei, Taiwan), Chih-Chiang Tsao (Taoyuan, Taiwan), Hao-Jan Pei (Hsinchu, Taiwan), Hsiu-Jen Lin (Zhubei, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes attaching a carrier to a semiconductor wafer using a release film; removing the carrier from the semiconductor wafer; and performing a treatment process to remov...