US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 24 for "Header circuit placement in memory device" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,197, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Header circuit placement in memory device" was invented by Po-Sheng Wang (Hsinchu, Taiwan), Yangsyu Lin (New Taipei, Taiwan), Kao-Cheng Lin (Taipei, Taiwan), Cheng Hung Lee (Hsinchu, Taiwan) and Jonathan Tsung-Yung Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are related to an integrated circuit including a semiconductor layer. In one aspect, the semiconductor layer includes a first region, a second region, and a third region. The first region may include a circuit array, and the second region may include ...