US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 24 for "Connect structure for semiconductor processing equipment" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,347, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Connect structure for semiconductor processing equipment" was invented by Ming-Sze Chen (Hsinchu, Taiwan), Hung-Chih Wang (Taichung, Taiwan), Yuan-Hsin Chi (Taichung County, Taiwan) and Sheng-Yuan Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A connect structure for semiconductor processing equipment includes a housing configured to mate a deformable pipe with a non-deformable pipe. The housing includes a first annular sidewall to receive the deformable pipe and a second annular sidewall defining a first thread structure. An...