US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Wafer positioning method and apparatus" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,602, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Wafer positioning method and apparatus" was invented by Chia-Cheng Chen (Hsinchu, Taiwan), Chih-Kai Yang (Taipei, Taiwan), Liang-Yin Chen (Hsinchu, Taiwan), Huicheng Chang (Tainan, Taiwan) and Yee-Chia Yeo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a method includes: placing a wafer on an implanter platen, the wafer including alignment marks; measuring a position of the wafer by measuring positions of the alignment marks with one or more cameras; determining an angular displacement between the position of the...