US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 17 for "Semiconductor package device and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,687, issued on Feb. 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor package device and method for manufacturing the same" was invented by Jen-Yuan Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package device includes a first semiconductor structure, a second semiconductor structure, and a non-metal dopant. The first semiconductor structure includes a first dielectric bonding layer and a first conductive bonding feature disposed in the first dielectric bonding layer. The second semiconductor structure includes a second dielectric bonding layer bonded to the ...