US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 17 for "Semiconductor devices and methods of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,375, issued on Feb. 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacturing the same" was invented by Ta-Chun Lin (Hsinchu, Taiwan), Chun-Jun Lin (Hsinchu, Taiwan), Kuo-Hua Pan (Hsinchu, Taiwan), Jhon Jhy Liaw (Hsinchu, Taiwan), Hsiu-Yu Kang (Taipei, Taiwan), Yu-Hsuan Lu (Kaohsiung, Taiwan) and Hui-Chi Chuang (Changhua, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to the present disclosure, hybrid fins positioned between two different epitaxial source/drain features are recessed to prevent conductive material from entering interior air gaps of the h...