US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Photonic assembly for enhanced bonding yield and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,064, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Photonic assembly for enhanced bonding yield and methods for forming the same" was invented by Yu-Hung Lin (Taichung, Taiwan), Chih-Hao Yu (Tainan, Taiwan), Wei-Ming Wang (Taichung, Taiwan), Chen Chen (New Taipei, Taiwan), Chia-Hui Lin (Shengang Township, Taiwan), Ren-Fen Tsui (Yungho, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photonic assembly includes: an electronic integrated circuits (EIC) die including a semiconductor substrate, semiconductor devices located on a horizontal surface of the semico...