ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,690, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structures" was invented by Jing-Cheng Lin (Hsinchu, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: a substrate having a first side and a second side opposite the first side; an interconnect structure adjacent the first side of the substrate; and an integrated circuit device attached to the interconnect structure; a through via extending from the first side of the substrate to the second side of the substrate, the through via being e...