US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Package structure with antenna element" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,661, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure with antenna element" was invented by Yung-Ping Chiang (Zhubei, Taiwan), Yi-Che Chiang (Hsinchu, Taiwan), Nien-Fang Wu (Chiayi, Taiwan), Min-Chien Hsiao (Taichung, Taiwan), Chao-Wen Shih (Zhubei, Taiwan), Shou-Zen Chang (Hsinchu, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a dielectric structure and an antenna structure disposed in the dielectric structure. The package structure also include...