US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Package devices and methods of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,062, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package devices and methods of manufacture" was invented by Tung-Liang Shao (Hsinchu, Taiwan), Yu-Sheng Huang (Hemei Township, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device is provided that includes: a photonic integrated circuit; a laser die comprising a welding pad; and a first optical fiber including: a first end of the first optical fiber fused to a surface of the photonic integrated circuit, wherein a first fusion bond exists between the first end of the first optical fiber and the surface of...