US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Multi-die package and methods of formation" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,646, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Multi-die package and methods of formation" was invented by Wen-Yi Lin (New Taipei, Taiwan), Kuang-Chun Lee (New Taipei, Taiwan), Chien-Chen Li (Hsinchu, Taiwan), Chien-Li Kuo (Hsinchu, Taiwan) and Kuo-Chio Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some implementations described herein a provide a multi-die package and methods of formation. The multi-die package includes a dynamic random access memory integrated circuit die over a system-on-chip integrated circuit die, and a heat transfer component between the system-on-c...