US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Method of manufacturing conductive structure, method of manufacturing redistribution circuit structure and method of manufacturing semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,666, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of manufacturing conductive structure, method of manufacturing redistribution circuit structure and method of manufacturing semiconductor package" was invented by Chung-Liang Chang (Hsinchu, Taiwan), Ming-Che Ho (Tainan, Taiwan) and Hung-Jui Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method including the following steps is provided. A seed layer is formed. Conductive material is formed on the seed layer by performing an electrolytic plating process with an electrolytic composition comprising: a source of copper io...