US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Method of fabricating package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,707, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of fabricating package structure" was invented by Chih-Hsuan Tai (Taipei, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Yu-Chih Huang (Hsinchu, Taiwan), Chia-Hung Liu (Hsinchu, Taiwan), Ting-Ting Kuo (Hsinchu, Taiwan), Ban-Li Wu (Hsinchu, Taiwan), Ying-Cheng Tseng (Tainan, Taiwan) and Chi-Hui Lai (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure including a first redistribution layer, a semiconductor die, through insulator vias, an insulating encapsulant and a second redistribution layer. The first redistributio...