US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 17 for "Interconnect structure and methods of forming the same" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,629, issued on Feb. 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Interconnect structure and methods of forming the same" was invented by Chien Chang (Hsinchu, Taiwan), Yen-Chun Lin (Hsinchu, Taiwan), Jen-Wei Liu (Taipei, Taiwan), Chih-Han Tseng (Tainan, Taiwan), Harry Chien (Chandler, Ariz.), Cheng-Hui Weng (Hsinchu, Taiwan), Chun-Chieh Lin (Taichung, Taiwan), Hung-Wen Su (Hsinchu, Taiwan), Ming-Hsing Tsai (Chu-Pei, Taiwan) and Chih-Wei Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect structure including a contact via in an interlayer dielectric, a first conductive featu...