US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Integrated chip inductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,305, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated chip inductor structure" was invented by Hung-Wen Hsu (Tainan, Taiwan), Po-Han Huang (Tainan, Taiwan) and Wei-Li Huang (Pingtung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to, in part, an inductor structure that includes an etch stop layer arranged over an interconnect structure overlying a substrate. A magnetic structure includes a plurality of stacked layers is arranged over the etch stop layer. The magnetic structure includes a bottommost layer that is wider than a topmost layer. A first con...