US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Bonding system with sealing gasket and method for using the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,612, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bonding system with sealing gasket and method for using the same" was invented by Chieh Chang (Hsinchu, Taiwan), Chen-Fong Tsai (Hsinchu, Taiwan), Yun Chen Teng (New Taipei, Taiwan), Han-De Chen (Hsinchu, Taiwan), Jyh-Cherng Sheu (Hsinchu, Taiwan), Huicheng Chang (Tainan, Taiwan) and Yee-Chia Yeo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor device includes mounting a bottom wafer on a bottom chuck and mounting a top wafer on a top chuck, wherein one of the bottom chuck and the top chuck has a ...