US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Semiconductor package with stiffener structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,775, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package with stiffener structure and method of manufacturing the same" was invented by Wensen Hung (Hsinchu County, Taiwan), Yu-Ling Tsai (Hsinchu, Taiwan), Chien-Chia Chiu (Taoyuan, Taiwan) and Tsung-Yu Chen (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first component, a second component, and a stiffener rib. The first component is disposed on a substrate. The second component is disposed aside the first component and on the substrate. The stiffener rib is disposed between the...