US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Semiconductor package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,792, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method of manufacturing the same" was invented by Chia-Kuei Hsu (Hsinchu, Taiwan), Feng-Cheng Hsu (New Taipei, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Po-Yao Lin (Hsinchu County, Taiwan), Shuo-Mao Chen (New Taipei, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor die, a redistribution circuit structure, a supporting structure and a protective layer. The redistribution circuit structure is located on and electrically coupled to the ...