US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Semiconductor package and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,778, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method of forming the same" was invented by Wei-Chih Chen (Taipei, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan), Po-Han Wang (Hsinchu, Taiwan) and Hung-Chun Cho (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a method of forming the same are provided. The semiconductor package includes a semiconductor die and a redistribution structure disposed on the semiconductor die. The redistribution structure includes an alignment auxiliary layer, a plurality of ...