US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Semiconductor package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,939, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and manufacturing method thereof" was invented by Feng-Wei Kuo (Hsinchu County, Taiwan) and Wen-Shiang Liao (Miaoli County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a manufacturing method thereof are provided. A die stack in the semiconductor package includes a photonic die and an electronic die stacked on the photonic die by a face-to-face manner. A convex lens is disposed at a back surface of the electronic die, and is formed in an oval shape, such that optical beams can be collimate...