US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 10 for "Selective deposition for integrated circuit interconnect structures" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,694, issued on Feb. 10, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Selective deposition for integrated circuit interconnect structures" was invented by Hsin-Yen Huang (New Taipei, Taiwan), Shao-Kuan Lee (Kaohsiung, Taiwan), Cheng-Chin Lee (Taipei, Taiwan), Hai-Ching Chen (Hsinchu, Taiwan) and Shau-Lin Shue (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Examples of an integrated circuit with an interconnect structure and a method for forming the integrated circuit are provided herein. In some examples, the method includes receiving a workpiece that includes a substrate and an interconnect structur...