US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Interposer with built-in wiring for testing an embedded integrated passive device and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,798, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interposer with built-in wiring for testing an embedded integrated passive device and methods for forming the same" was invented by Kuo-Ching Hsu (Taipei, Taiwan), Hsiang-Tai Lu (Zhubei, Taiwan), Kuan-Lung Wu (Hsinchu, Taiwan) and Ya Huei Lee (Zhunan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes: an interposer including an integrated passive device, a die-side redistribution structure, first on-interposer bump structures, and second on-interposer bump structures. First die-side redistribution wi...