US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,417, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit packages and methods of forming the same" was invented by Yu-Hung Lin (Taichung, Taiwan), Jih-Churng Twu (Hsinchu, Taiwan), Su-Chun Yang (Hsinchu, Taiwan), Shih-Peng Tai (Xinpu Township, Taiwan) and Yu-Hao Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding a first semiconductor die and a second semiconductor die to a substrate, where a gap is disposed between a first sidewall of the first semiconductor die and a second sidewall of the second semiconductor die, performing a plasma treatm...