US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,734, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Jiun Yi Wu (Zhongli, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device package includes a first die directly bonded to a second die at an interface, wherein the interface comprises a metal-to-metal bond and a heat dissipation feature over the first die. The heat dissipation feature includes a thermal base over the first die and surrounding the second die, wherein the thermal base is made of a metal; and a plurality of thermal vias on the thermal b...