US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,793, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Yung-Chi Lin (Su-Lin, Taiwan) and Wen-Chih Chiou (Zhunan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device package includes a first die directly bonded to a second die at an interface, wherein the interface comprises a conductor-to-conductor bond. The device package further includes an encapsulant surrounding the first die and the second die and a plurality of through vias extending through the encapsulant. The plurality of through vias are...