US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Heat spreading device and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,729, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Heat spreading device and method" was invented by Tsung-Shu Lin (New Taipei, Taiwan), Wensen Hung (Zhubei, Taiwan), Hung-Chi Li (Taipei, Taiwan) and Tsung-Yu Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: a die stack over and electrically connected to an interposer, the die stack including a topmost integrated circuit die including: a substrate having a front side and a back side opposite the front side, the front side of the substrate including an active surface; a dummy through substrate...