US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Embedded stress absorber in package" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,770, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Embedded stress absorber in package" was invented by Shin-Puu Jeng (Hsinchu, Taiwan), Chien-Sheng Chen (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan), Po-Chen Lai (Hsinchu, Taiwan) and Shu-Shen Yeh (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding a first package component over a second package component. The second package component includes a plurality of dielectric layers, and a plurality of redistribution lines in the plurality of dielectric layers. The method further includes dispensing a stre...