US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 9 for "Semiconductor arrangement and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,583, issued on Dec. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Semiconductor arrangement and method of manufacture" was invented by Pei-Yu Wang (Hsinchu, Taiwan) and Sai-Hooi Yeong (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor arrangement comprises forming a fin over a semiconductor layer. A gate structure is formed over a first portion of the fin. A second portion of the fin adjacent to the first portion of the fin and a portion of the semiconductor layer below the second portion of the fin are removed to define a recess. A stress-inducing material is form...