US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 30 for "Method of fabricating memory device and package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,419, issued on Dec. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of fabricating memory device and package structure" was invented by Kai-Ming Chiang (Hsinchu, Taiwan), Chao-wei Li (Hsinchu, Taiwan), Wei-Lun Tsai (Hsinchu, Taiwan), Chia-Min Lin (Hsinchu, Taiwan), Yi-Da Tsai (Chiayi Country, Taiwan), Sheng-Feng Weng (Taichung, Taiwan), Yu-Hao Chen (HsinChu, Taiwan), Sheng-Hsiang Chiu (Tainan, Taiwan), Chih-Wei Lin (Hsinchu County, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device including a base semiconductor die, conductive terminals, memory dies,...