US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 23 for "Photonic semiconductor-insulator-semiconductor modulator and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,654, issued on Dec. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Photonic semiconductor-insulator-semiconductor modulator and methods for forming the same" was invented by Tien-Lin Shen (Taipei, Taiwan), Ming Lee (Taipei, Taiwan), Wei-Heng Lin (Taipei, Taiwan), Hsing-Kuo Hsia (Jhubei, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment photonic device may include a first terminal including silicon and a second terminal including polysilicon. The first terminal may be configured as a first three-dimensional structure extending along a first direction and having a...