US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 2 for "Semiconductor structure and method manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,077, issued on Dec. 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and method manufacturing the same" was invented by Ming-Fa Chen (Taichung, Taiwan), Sung-Feng Yeh (Taipei, Taiwan), Tzuan-Horng Liu (Taoyuan, Taiwan) and Chao-Wen Shih (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first semiconductor device, a second semiconductor device, a connection device and a redistribution circuit structure. The first semiconductor device is bonded on the second semiconductor device. The connection device is bonded on the second semiconductor...