US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 2 for "Semiconductor package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,062, issued on Dec. 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and manufacturing method thereof" was invented by Chung-Hao Tsai (Changhua County, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan), Chuei-Tang Wang (Taichung, Taiwan), Wei-Ting Chen (Tainan, Taiwan), Chien-Hsun Chen (Pingtung County, Taiwan) and Shih-Ya Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is dispos...