US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 2 for "Metal nanoparticles in an amorphous bonding layer between a device substrate and carrier substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,082, issued on Dec. 2, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Metal nanoparticles in an amorphous bonding layer between a device substrate and carrier substrate" was invented by Zheng-Yong Liang (Hsinchu, Taiwan), Yu-Yun Peng (Hsinchu, Taiwan), Keng-Chu Lin (Hsinchu, Taiwan), Wei-Ting Yeh (Hsinchu, Taiwan), Chia-Yun Cheng (Hsinchu, Taiwan), Chen-Hao Wu (Hsinchu, Taiwan), Yu-Wei Lu (Hsinchu, Taiwan), Han-De Chen (Hsinchu, Taiwan), Hsu-Kai Chang (Hsinchu, Taiwan), Kuei-Lin Chan (Hsinchu, Taiwan), Kenichi Sano (Hsinchu, Taiwan), Huang-Lin Chao (Hsinchu, Taiwan), Cheng-I Chu (Hsinchu, Taiwan) and Yi-Rui Chen (Hsinchu, Taiwan).

According to ...