US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Connecting structure, package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,195, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Connecting structure, package structure and manufacturing method thereof" was invented by Tsung-Fu Tsai (Changhua County, Taiwan), Jian-Yang He (Tainan, Taiwan), Ying-Ching Shih (Hsinchu, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A structure including a substrate having a conductive pad and a connecting structure disposed on the conductive pad and electrically connected to the conductive pad. The connecting structure includes a first metallic layer disposed on the conductive pad, a first intermetallic c...