US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Composite particulates for use as part of a supporting fill mixture in a semicondutor substrate stacking application" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,093, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Composite particulates for use as part of a supporting fill mixture in a semicondutor substrate stacking application" was invented by Kuo-Ming Wu (Zhubei, Taiwan), Hau-Yi Hsiao (Chiayi, Taiwan), Kai-Yun Yang (Tainan, Taiwan), Che Wei Yang (New Taipei, Taiwan), Sheng-Chau Chen (Tainan, Taiwan), Chung-Yi Yu (Hsin-Chu, Taiwan) and Cheng-Yuan Tsai (Chu-Pei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some implementations described herein include systems and techniques for fabricating a stacked die product. The systems and techniques include ...