US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 4 for "Semiconductor device with backside interconnection and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,747, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device with backside interconnection and method for forming the same" was invented by Jui-Lin Chen (Taipei City, Taiwan), Hsin-Wen Su (Hsinchu, Taiwan), Chih-Ching Wang (Kinmen County, Taiwan), Chen-Ming Lee (Yangmei City, Taiwan), Chung-I Yang (Hsinchu City, Taiwan), Yi-Feng Ting (Taipei City, Taiwan), Jon-Hsu Ho (New Taipei City, Taiwan), Lien-Jung Hung (Taipei, Taiwan) and Ping-Wei Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a first fin and a second fin protruding from a frontsi...