US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Package structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,053, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of manufacturing the same" was invented by Wei-Chih Chen (Taipei City, Taiwan), Hung-Jui Kuo (Hsinchu City, Taiwan), Yu-Hsiang Hu (Hsinchu City, Taiwan), Sih-Hao Liao (New Taipei City, Taiwan) and Hung-Chun Cho (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a semiconductor die, an insulating encapsulation, a first redistribution circuit structure and a surface-modifying film. The semiconductor die has conductive terminals. The insulating encapsulation laterally encapsulates t...