US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Package devices and methods of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,699,234, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package devices and methods of manufacture" was invented by Shih Wei Liang (Taichung City, Taiwan), Yu-Ming Chou (Hsinchu, Taiwan), Nien-Fang Wu (Chiayi City, Taiwan) and Jiun Yi Wu (Zhongli City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Package devices and methods of manufacture are discussed. In an embodiment, a method of manufacturing an integrated circuit device includes: forming an optical device layer; forming an optical layer on the optical device layer; after the forming the optical layer, forming a first opening in the optical ...