US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Package and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,060, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package and method for forming the same" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Meng-Liang Lin (Hsinchu, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package is provided in accordance with some embodiments. The package includes a substrate including a first conductive via embedded in a first substrate core; a conductive pattern disposed on the first substrate core, wherein the conductive pattern includes a first conductive pad and a second conductive pad; a second substrate core disposed on t...