US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Method for singulating semiconductor devices and manufacturing a package device including the semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,006, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method for singulating semiconductor devices and manufacturing a package device including the semiconductor devices" was invented by Hsien-Ju Tsou (Taipei, Taiwan), Yung-Chi Lin (Su-Lin City, Taiwan), Yi-Hsiu Chen (Hsinchu, Taiwan) and Tsang-Jiuh Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes an integrated circuit die including a first sidewall, a second sidewall, and a third sidewall, wherein the third sidewall of the integrated circuit die is connected to the first sidewall of the integrated ...