US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 26 for "Semiconductor tool having controllable ambient environment processing zones" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,398,468, issued on Aug. 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor tool having controllable ambient environment processing zones" was invented by Chiao-Chun Hsu (Hsinchu, Taiwan), Chih-Ming Chen (Hsinchu, Taiwan), Chung-Yi Yu (Hsin-Chu, Taiwan) and Sheng-Hsun Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, a semiconductor fabrication tool is provided. The semiconductor fabrication tool includes a first heating plate arranged within a processing chamber and a second heating plate arranged within the processing chamber vertically over the first heating plate. A ...